China IC Packaging Technology Innovation Union set up in Beijing 2010-01-05
China IC Packaging Technology Innovation Union set up in Beijing
 
On 30th Dec. 2010 a.m , the founding meeting of China IC Packaging Technology Innovation Union was held at China Ministry of Science and Technology. Grand Tec CEO Mr. Wade Lam lead the delegates to join.
 
This union is authorized by China Ministry of Science and Technology, and many famous enterprises & groups,  group was established  and became the official member, including Jiangsu Changjiang Electronics Tech Co., Ltd,; NanTong Fujitsu Microelectronics Co., ltd; Tinghua University; Fudan University; Grand Tech (Shenzhen) Co., Ltd etc.
 
At this meeting, Grand Tec Vice Pres. Mr Liu Baolong was honored to be Union director.

 

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