Grand Tec specializes in developing and manufacturing our own brand of IC back-end packaging equipment, such as laser marking systems, wafer inspection systems, water jet deflashing systems, and tape & reel systems.
Laser Marking Systems
RecommendedModels：GM60 GM90 GM40 GM60Multi-function Laser Marking System Technical Advantages
1. Both stack and slot magazine loader and unloader
2. Auto track width adjustment，suitable for many different sizes of strips
3. Accurate position is done by locator pins and vision system Technical Specification 1. UPH：1000strip/hr (Dry Run)
2. MTBA:60mins
3. Strip Size：Length：160～250mm；Width： 30～90mm
GM90 High Precision Laser Marking System
Technical Advantages
1.track width adjustment , suitable for many different sizes of strips
2.Accurate position is done by locator pins and vision system
3.Optimized strip loader and unloader design，which provides robust strip handling，avoids double push，miss push or cracking by force push on strips;
4. Optimized strip press mechanism, to ensure laser marking accuracy Technical Specification 1.UPH：26～30strip/hr 2.MTBA:120mins; 3.Yield： ≥ 99.99%
4. Laser Line Width：min17µm ; 5.Marking Accuracy： ± 20µm
6.Strip Size: Length：180～210mm;Width： 30～60mm;Minimum IC :0.6*0.3mm
GM40 Low Cost Strip Laser Marking System
Technical Advantages
1. Locating system changeable, auto adaption of cylinder for distinct track width
2. Orientation vision system 、 two-dimensional code Reading 、 Post-mark sampling inspection ( optional )
3. Reject box is installed
4. Modular design, fast conversion Technical Specification1. Magazine: Stack magazines; 2. UPH: 800 strip/hr(Dry Run)
3. MTTC: < 20 min
4. Strip Size ：Length： 180～280mm;Width： 25～90mm;Thickness: 0.15～2mm
Inspection Systems
RecommendedModels：CIS126 GR20 GIS126Fully-auto 3rd Optical System Technical Advantages
1. Multi-box automatic onload/offload, Simple operation;
2. Special designs for total strip safety，zero damage of strip is ensured;
3. Using two cameras detect tablets IC gold wire bonding defects simultaneously, improve equipment UPH. Technical Specification 1.UPH > 30K unit; 2.MTBA: <60 Min; 3.MTTC: <30 Min
4.Strip Damage Rate：0; 5.Strip Width40mm～90mm
GR20 Tray to Tray/Reel Inspection System/Reel System
Technical Advantages1. Pick & place arms with four pads,Easy handling and wide compatibility
2. Sucking fingers’ pitch is automatically adjusted range from 9mm to 25mm , compatible with a variety of chips and Tray disks without any conversion kits
3. 2D and 3D inspection and data/image bank function Technical Specification 1.UPH： Tray to Tray≥ 8K；Tray to Reel≥5K
Without tape and reel function UPH can reach 15K.
2.MTBA≧ 60 min; 3.MTBF≧ 168H；4. 2D overkill/underkill: <0.03%; 3D overkill/underkill: <0.05%; 5.±0.01mm3D visual accuracy: ±0.01mm
Test Handler
RecommendedModels：GR30 CIS130 GR30 Torrent Test Handler Technical Advantages 1.High-precision DD motor drive, 16 positions are free to exchange. Only one vacuum source to complete all of the vacuum suction, unique vacuum blocking system can finish accurate pick and place material in high-speed work
2.The optical imaging system with patented technology, high-speed, high stability, can distinguish chip’s appearance and size 、direction 、 a variety of appearance and pin defects accurately at high speed
3.Four-position power measurement platform can feedback the electrical parameters of the test chip to server for recording
4.Up to eight sorting positions, can classify and screen the chip of different test results;
5.Tape / Barrel packaging two output modes provided. Technical Specification 1.UPH: 36K/H; 2.Feeding mode: Vibration plate / Barrel
3. Test interface: TCP /IP;GPIP;I /O
4. Applicable package type: SOP,QFN,DPAK,TO,SOT,SOIC, etc.
GIS130 Pick and Place Test Handler
Technical Advantages
1.Multiple tray boxes loading automatically makes continuous producing possible, easy handling
2.Cylinder fix chips position after transporting by tray; Sucking finger, tray box and testing area all have location component, stability ensured
3.Pick & place arms among material feeding area could stretch equal distance, each two of them in charge of an area
4.Two tray boxes used in chips testing area. Each box equipped pick & place arms for IC circuit test, enhance UPH
5.Software acquire testing result from communication interface and manage pick & place arms in downloading area for classification Technical Specification
1.UPH: 8000 unit; 2.MTBA: 60 mins
3.MTTC : 30 mins; 4.Chip Damage Rate：0
Trim/Sorting Systems
GIS160Sorting System
Technical Advantages 1.Recognition of artificial identification marking on IC package by vision system;
2.Motive power integrated, special punching module solution for cutting tool control;
3.Synchronized lifting mechanism using connecting rod as foundation. Technical Specification 1.UPH: 1000 Strips/ H; 2.MTBA: 60 mins
3.Accuracy rate: 99.995%
4.Strip Size: Length：150mm～270mm Width： 30mm～00mm
5.Cutting Accuracy: ±0.05mm; 6.Mapping functions contained
7.Orientation checking vision system provided.
Wafer Inspection Systems
GWIAutomatic Wafer Inspection System Discription：
1．High Speed High Accuracy
2．PC Based Control System
3．Intelligent Vision Inspection & Robot System
4．User Friendly Interface
5．Inspection throughput>70 wafers per hour
6. Selectable detection area(from 0 to 100%)
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