CSIA Packaging Branch 3rd representative conference was held in Beijing 2013-01-09
CSIA Packaging Branch 3rd representative conference was held in Beijing
 
 
12  November 2012, China Semiconductor Industry Association (CSIA) packaging branch 3rd representative conference was held in Beijing. General election for governing units was participated by all representatives,  3rd rotating President, General Secretary  and Executive Director of council was elected. The Vice President of Grand Mr. Louis Liu was elected as Executive Director, Grand Tec CEO Mr. Wade Lam was elected Chairman of the Honorary Adviser.
 
 Executive Director of second council Keyun Bi was elected Honorary President, Chairman of JCET Xinchang Wang was elected rotating President of 3rd Council has an advocate for local enterprises in the industry  to the development of innovative enterprises, and the development of high-end products in the domestic and international market  make bigger and stronger. ( Sylvia )
 

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