Grand Tec CEO lead a delegation to the 7th China Semiconductor Market Seminar

  10-12 June 2009, The 7th Chinese semiconductor packaging & testing technology and market seminars was held in Wuxi, Jiangxu Provice, the main conference seminar package was to test the market trends, advanced packaging, testing technologies, and green packaging industry is the hot spot topic.  CEO Mr. Lam Yee Lung Wade, personally lead Grand Tec team to participate in the workshop, and also conducted a presentation in seminar.

The seminar participated by Electronic Information Division of the Ministry of Industry and Information Technology, Chinese Institute of Electronics Supervised by the China Semiconductor Industry Association, Wuxi Municipal People's Government organized packaging branch by the China Semiconductor Industry Association, Wuxi New District Administrative Committee, Municipal People's Government, Wuxi City informatization Office co-hosted the Wuxi national IC Design base Co., Ltd. and co. Yu Zhongyu, chairman of the China Semiconductor Industry Association, Vice Mayor of Wuxi Municipal People's Government, Fang Wei, vice chairman of the China Semiconductor Industry Association, the packaging branch Chairman Bike Yun, Xu Juyan, academicians of the Chinese Academy of Engineering and the Ministry of Industry and Information Technology, Integrated Circuits at Miss Guo Lili other leaders, experts, as well as a total of more than 400 people attended the event. Semiconductor Equipment Division Director Tian Liang, Deputy Director Zhang Songling, Senior Marketing Manager Li Xianghua, Liu Xingguo accompanying Wade Lam was part of the attendees.

At the Meeting, Vice Chairman of the China Semiconductor Industry Association, the packaging branch chairman Bike Yun, Wuxi New District Information Industry Science and Technology Park Management Center Director Chen Tianbao, Chinese Academy of Engineering Xu Juyan, director of the Institute of Microelectronics sweet leaf spring and other leading experts published a wonderful Keynote. Tian Liang and Zhang Songling, conducted ​​a presentation entitled "to explore the reliability of semiconductor devices" and "high-speed vision inspection applications in semiconductor devices,"  the keynote speech, causing widespread concern in the industry.

Morning, 11 June 2009, the General Assembly held a special forum entitled "Forum of the opportunities and challenges facing the current situation of semiconductor packaging and testing industry". The Summit Forum chaired by the Secretary-General of the Shanghai Integrated Circuit Industry Association, Professor Jiang Shoulei four guests are Jiangsu Changjiang Electronics Technology Co., Ltd.,  Nantong Fujitsu Microelectronics Co., Ltd., general manager Shi Lei, Henkel Huawei Electronics Limited,  general manager Hanjiang Long and Grand Group Chairman Wade Lam .

Afternoon, 9 June 2009, the branch of China's semiconductor industry packaging held a second 3rd Council in Wuxi, commissioned by Wade Lam, chairman, Li Xianghua participated in the Council.

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