China IC Packaging Technology Innovation Union set up in Beijing On 30th Dec. 2010 a.m , the founding meeting of China IC Packaging Technology Innovation Union was held at Chi...
Grand Tec won the Technology Innovation Award in Bao'an District, Shenzhen China 4 Dec. 2010, at Bao'n District government building hall, Baoan Technol...
GRAND participated in 11 th Hi-tech Fair at Shenzhen Exhibit Center From Nov 16 to 21, 2010, the 11 th China Hi-tech Fair was held at Shenzhen Exhibit Center. This Fair is...
Grand Tech signed Robot Agency Agreement with Epson On Sep 24, 2009, Grand Tech Group Ltd. and Epson (China) Co. Ltd Robot agency cooperation signing agreement was held in Gr...
Grand Tec sent delegate to visit Shanghai Bao steel Group On 11 - 13 Sep. 2009, CEO Mr. Wade Lam led Grand tec delegates to visit Shanghai Bao steel Group. The theme is ";what...
Grand Technologies Shanghai Branch was Officially Established Grand Technologies Shanghai Branch was officially established on August 11, 2009. It is located in Jinqiao Export Proc...
Grand Technologies Shanghai Branch was Officially Established Grand Technologies Shanghai Branch was officially established on August 11, 2009. It is located in Jinqiao Export Proc...
Grand Tec was awarded the title of 2008 Shenzhen labor relations harmonious enterprise Grand Technology ( Shenzhen ) Co., Ltd. was awarded the honorary title...
Grand Tec CEO lead a delegation to the 7th China Semiconductor Market Seminar 10-12 June 2009, The 7th Chinese semiconductor packaging & testing technology and...
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